MULTI-LAYER CIRCUIT ASSEMBLY AND PROCESS FOR PREPARING THE SAME

Details for Australian Patent Application No. 2002253904 (hide)

Owner PPG INDUSTRIES OHIO, INC.

Inventors STURNI, Lance C.; OLSON, Kevin C.

Pub. Number AU-A-2002253904

PCT Pub. Number WO2002/073685

Priority 09/802,001 08.03.01 US; 09/851,904 09.05.01 US; 09/901,373 09.07.01 US

Filing date 5 February 2002

Wipo publication date 24 September 2002

International Classifications

H01L 021/48 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

20 March 2003 Application Open to Public Inspection

  Published as AU-A-2002253904

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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