METHOD FOR DRY ETCHING A SEMICONDUCTOR WAFER

Details for Australian Patent Application No. 2002253690 (hide)

Owner KANG, Hyosang

Inventors KANG, Hyosang

Pub. Number AU-A-2002253690

PCT Pub. Number WO2003/075334

Priority 2002/11397 04.03.02 KR

Filing date 19 April 2002

Wipo publication date 16 September 2003

International Classifications

H01L 021/3065 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

23 October 2003 Application Open to Public Inspection

  Published as AU-A-2002253690

18 November 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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