APPARATUS AND METHODS WITH RESOLUTION ENHANCEMENT FEATURE FOR IMPROVING ACCURACY OF CONVERSION OF REQUIRED CHEMICAL MECHANICAL POLISHING PRESSURE TO FORCE TO BE APPLIED BY POLISHING HEAD TO WAFER

Details for Australian Patent Application No. 2002252540 (hide)

International Classifications

Event Publications

3 April 2003 Application Open to Public Inspection

Published as AU-A-2002252540

19 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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