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Details for Australian Patent Application No. 2002252088 (hide)

Owner CHIPPAC, INC.

Inventors PENDSE, Rajendra; TAM, Samuel

Pub. Number AU-A-2002252088

PCT Pub. Number WO2002/069399

Priority 60/272,236 27.02.01 US; 10/084,787 25.02.02 US

Filing date 26 February 2002

Wipo publication date 12 September 2002

International Classifications

H01L 023/02 Details of semiconductor or other solid state devices - Containers

H01L 023/34 Details of semiconductor or other solid state devices - Arrangements for cooling, heating, ventilating or temperature compensation

H01L 023/52 Details of semiconductor or other solid state devices - Arrangements for conducting electric current within the device in operation from one component to another

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

H01L 029/40 Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier - Electrodes

Event Publications

6 March 2003 Application Open to Public Inspection

  Published as AU-A-2002252088

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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