SEMICONDUCTOR DIE PACKAGE HAVING MESH POWER AND GROUND PLANES

Details for Australian Patent Application No. 2002252063 (hide)

Owner SILICON BANDWIDTH INC.

Inventors CRANE, Stanford, W., Jr.; JEON, Myoung-soo; OGATA, Charley, Takeshi; WANG, Ton-Yong; CANGELLARIS, Andreas, C.; SCHUTT-AINE, Jose

Pub. Number AU-A-2002252063

PCT Pub. Number WO2002/069397

Priority 60/270,635 23.02.01 US; 09/867,438 31.05.01 US

Filing date 25 February 2002

Wipo publication date 12 September 2002

International Classifications

H01L 023/00 Details of semiconductor or other solid state devices

Event Publications

6 March 2003 Application Open to Public Inspection

  Published as AU-A-2002252063

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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