MINIMIZING RESISTANCE AND ELECTROMIGRATION OF INTERCONNECT BY ADJUSTING ANNEAL TEMPERATURE AND AMOUNT OF SEED LAYER DOPANT

Details for Australian Patent Application No. 2002251860 (hide)

Owner ADVANCED MICRO DEVICES, INC.

Inventors MARATHE, Amit, P.; WANG, Pin-Chin, C.; LOPATIN, Sergey

Pub. Number AU-A-2002251860

PCT Pub. Number WO2002/099874

Priority 09/872,717 01.06.01 US

Filing date 31 January 2002

Wipo publication date 16 December 2002

International Classifications

H01L 021/768 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

8 May 2003 Application Open to Public Inspection

  Published as AU-A-2002251860

11 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2002251861-Injectable porous bone graft materials

2002251859-FLUOROCHEMICAL COMPOSITION