POST-ETCH PHOTORESIST STRIP WITH 02 AND NH3 FOR ORGANOSILICATE GLASS LOW-K DIELECTRIC ETCH APPLICATIONS

Details for Australian Patent Application No. 2002250017 (hide)

Owner LAM RESEARCH CORPORATION

Inventors ANNAPRAGADA, Rao, V.; MOREY, Ian, J.; HO, Chok, W.

Pub. Number AU-A-2002250017

PCT Pub. Number WO2002/065513

Priority 09/782,678 12.02.01 US

Filing date 30 January 2002

Wipo publication date 28 August 2002

International Classifications

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

20 February 2003 Application Open to Public Inspection

  Published as AU-A-2002250017

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2002250018-COALESCING AND SEPARATING ARRANGEMENTS, SYSTEMS, AND METHODS FOR LIQUID MIXTURES

2002250016-SYNCHRONIZED HALF-DUPLEX, RESIDENTIAL TV COAX, DIGITAL HIGH-SPEED MULTIMEDIA LOCAL AREA COMMUNICATION SYSTEM