METHOD FOR MULTILEVEL COPPER INTERCONNECTS FOR ULTRA LARGE SCALE INTEGRATION

Details for Australian Patent Application No. 2002247068 (hide)

Owner MICRON TECHNOLOGY, INC.

Inventors AHN, Kie, Y.; GEUSIC, Joseph, E.

Pub. Number AU-A-2002247068

PCT Pub. Number WO2002/063672

Priority 09/777,816 05.02.01 US

Filing date 4 February 2002

Wipo publication date 19 August 2002

International Classifications

H01L 021/4763 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

13 February 2003 Application Open to Public Inspection

  Published as AU-A-2002247068

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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