METHOD OF INTEGRATING A HEAT SPREADER AND A SEMICONDUCTOR, AND PACKAGE FORMED THEREBY

Details for Australian Patent Application No. 2002245202 (hide)

Owner SUN MICROSYSTEMS, INC.

Inventors DAVIDSON, Howard, L.; LYTEL, Richard

Pub. Number AU-A-2002245202

PCT Pub. Number WO2002/056376

Priority 09/715,360 17.11.00 US

Filing date 13 November 2001

Wipo publication date 24 July 2002

International Classifications

H01L 023/367 Details of semiconductor or other solid state devices

H01L 023/373 Details of semiconductor or other solid state devices

Event Publications

6 February 2003 Application Open to Public Inspection

  Published as AU-A-2002245202

29 January 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2002245203-SPINNING, PROCESSING, AND APPLICATIONS OF CARBON NANOTUBE FILAMENTS, RIBBONS, AND YARNS

2002245201-PROCESS FOR THE PRODUCTION OF DIARYL CARBONATES