THERMALLY ENHANCED MICROCIRCUIT PACKAGE AND METHOD OF FORMING SAME

Details for Australian Patent Application No. 2002245046 (hide)

Owner HARRIS CORPORATION

Inventors RUMPF, Raymond; GAMLEN, Carol; NEWTON, Charles

Pub. Number AU-A-2002245046

PCT Pub. Number WO2002/052644

Priority 09/727,140 30.11.00 US

Filing date 28 November 2001

Wipo publication date 8 July 2002

International Classifications

H01L 023/473 Details of semiconductor or other solid state devices

B81B 001/00 Devices without movable or flexible elements, e.g. micro-capillary devices

Event Publications

23 January 2003 Application Open to Public Inspection

  Published as AU-A-2002245046

5 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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