HIGH FREQUENCY INTEGRATED CIRCUIT (HFIC) MICROSYSTEMS ASSEMBLY AND METHOD FOR FABRICATING THE SAME

Details for Australian Patent Application No. 2002244794 (hide)

Owner JUHOLA, Tarja

Inventors JUHOLA, Tarja

Pub. Number AU-A-2002244794

PCT Pub. Number WO2002/082537

Priority 60/282,226 06.04.01 US; 60/288,697 04.05.01 US

Filing date 8 April 2002

Wipo publication date 21 October 2002

International Classifications

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

H01L 023/52 Details of semiconductor or other solid state devices - Arrangements for conducting electric current within the device in operation from one component to another

B81C 001/00 Manufacture or treatment of devices or systems in or on a substrate

Event Publications

10 April 2003 Application Open to Public Inspection

  Published as AU-A-2002244794

19 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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