HIGH DENSITY PACKAGING OF ELECTRONIC COMPONENTS

Details for Australian Patent Application No. 2002244141 (hide)

Owner L-3 COMMUNICATIONS CORPORATION

Inventors WATSON, Edwin, George

Pub. Number AU-A-2002244141

PCT Pub. Number WO2002/080309

Priority 09/822,876 30.03.01 US

Filing date 25 February 2002

Wipo publication date 15 October 2002

International Classifications

H01R 012/28 Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

Event Publications

3 April 2003 Application Open to Public Inspection

  Published as AU-A-2002244141

19 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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