SYSTEM AND METHOD FOR POLISHING AND PLANARIZING SEMICONDUCTOR WAFERS USING REDUCED SURFACE AREA POLISHING PADS AND VARIABLE PARTIAL PADWAFER OVERLAPPING TECHNIQUES

Details for Australian Patent Application No. 2002241637 (hide)

Owner LAM RESEARCH CORPORATION

Inventors KISTLER, Rod; BOYD, John, M.; GOTKIS, Yehiel

Pub. Number AU-A-2002241637

PCT Pub. Number WO2002/053322

Priority 09/754,480 04.01.01 US

Filing date 13 December 2001

Wipo publication date 16 July 2002

International Classifications

B24B 037/04 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped - designed for working plane surfaces

Event Publications

23 January 2003 Application Open to Public Inspection

  Published as AU-A-2002241637

5 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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