METHOD FOR ENCAPSULATING A CHIP HAVING A SENSITIVE SURFACE

Details for Australian Patent Application No. 2002241404 (hide)

Owner EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V.

Inventors RABEN, Jurgen

Pub. Number AU-A-2002241404

PCT Pub. Number WO2002/078077

Priority 01201122.7 26.03.01 EP

Filing date 26 March 2002

Wipo publication date 8 October 2002

International Classifications

H01L 021/56 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

27 March 2003 Application Open to Public Inspection

  Published as AU-A-2002241404

19 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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