MICROWAVE PLASMA PROCESS DEVICE, PLASMA IGNITION METHOD, PLASMA FORMING METHOD, AND PLASMA PROCESS METHOD

Details for Australian Patent Application No. 2002241321 (hide)

Owner OHMI, Tadahiro TOKYO ELECTRON LIMITED

Inventors GOTO, Tetsuya; SUGAWA, Shigetoshi; HIRAYAMA, Masaki; OHMI, Tadahiro

Pub. Number AU-A-2002241321

PCT Pub. Number WO2002/080254

Priority 2001-094277 28.03.01 JP

Filing date 28 March 2002

Wipo publication date 15 October 2002

International Classifications

H01L 021/3065 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/205 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C23C 016/511 Chemical deposition or plating by decomposition

H01L 021/265 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B01J 019/08 Chemical, physical, or physico-chemical processes in general - Processes employing the direct application of electric or wave energy, or particle radiation

H05H 001/46 Generating plasma - using applied electromagnetic fields, e.g. high frequency or microwave energy

H01L 021/31 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

3 April 2003 Application Open to Public Inspection

  Published as AU-A-2002241321

19 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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