ABRASIVE FREE FORMULATIONS FOR CHEMICAL MECHANICAL POLISHING OF COPPER AND ASSOCATED MATERIALS AND METHOD OF USING THE SAME

Details for Australian Patent Application No. 2002240041 (hide)

Owner ADVANCED TECHNOLOGY MATERIALS, INC.

Inventors BERNHARD, David; MA, Ying; JONES, Michael; BAUM, Thomas, H.; VERMA, Deepak

Pub. Number AU-A-2002240041

PCT Pub. Number WO2003/018714

Priority 09/935,805 23.08.01 US

Filing date 23 January 2002

Wipo publication date 10 March 2003

International Classifications

C09K 013/00 Etching, surface-brightening or pickling compositions

C09K 013/06 Etching, surface-brightening or pickling compositions

H01L 021/302 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

5 June 2003 Application Open to Public Inspection

  Published as AU-A-2002240041

6 May 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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