FLIP CHIP PACKAGE SEMICONDUCTOR DEVICE HAVING DOUBLE STUD BUMPS AND METHOD OF FORMING SAME
Details for Australian Patent Application No. 2002239897 (hide)
Event Publications
6 February 2003 Application Open to Public Inspection
Published as AU-A-2002239897
10 July 2003 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired
Application withdrawn under section 141(3)/See Reg. 8.3(2). Note that applications or patents shown as lapsed or ceased may be restored at a later date.
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