SEMICONDUCTOR PACKAGE WITH INTERNAL HEAT SPREADER

Details for Australian Patent Application No. 2002239661 (hide)

Owner THERMAL CORP.

Inventors GARNER, Scott, D.; ZUO, Jon

Pub. Number AU-A-2002239661

PCT Pub. Number WO2002/053999

Priority 09/753,893 03.01.01 US

Filing date 19 December 2001

Wipo publication date 16 July 2002

International Classifications

F28D 015/00 Heat-exchange apparatus employing intermediate heat-transfer media or bodies

H05K 007/20 Constructional details common to different types of electric apparatus - Modifications to facilitate cooling, ventilating, or heating

H01L 023/12 Details of semiconductor or other solid state devices - Mountings, e.g. non-detachable insulating substrates

H01L 023/34 Details of semiconductor or other solid state devices - Arrangements for cooling, heating, ventilating or temperature compensation

Event Publications

23 January 2003 Application Open to Public Inspection

  Published as AU-A-2002239661

5 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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