PHOTOSENSITIVE RESIN COMPOSITION

Details for Australian Patent Application No. 2002238903 (hide)

Owner SHOWA HIGHPOLYMER CO., LTD.

Inventors UEI, Hiroshi; OTANI, Kazuo

Pub. Number AU-A-2002238903

PCT Pub. Number WO2003/032090

Priority 2001-302492 28.09.01 JP

Filing date 14 March 2002

Wipo publication date 22 April 2003

International Classifications

G03F 007/027 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

C08G 059/14 Polycondensates containing more than one epoxy group per molecule

Event Publications

3 July 2003 Application Open to Public Inspection

  Published as AU-A-2002238903

17 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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