APPARATUS AND PROCESS FOR PRECISE ENCAPSULATION OF FLIP CHIP INTERCONNECTS

Details for Australian Patent Application No. 2002237005 (hide)

Owner CHIPPAC, INC.

Inventors PENDSE, Rajendra

Pub. Number AU-A-2002237005

PCT Pub. Number WO2002/069377

Priority 60/272,280 27.02.01 US; 10/081,425 22.02.02 US

Filing date 25 February 2002

Wipo publication date 12 September 2002

International Classifications

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/44 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/48 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/50 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/64 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof - Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not specially adapted for a single type of device provided for in groups

B23K 001/20 Soldering, e.g. brazing, or unsoldering - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating

B23K 031/02 Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups - relating to soldering or welding

Event Publications

6 March 2003 Application Open to Public Inspection

  Published as AU-A-2002237005

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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