METHOD OF MOUNTING A SEMICONDUCTOR DIE ON A SUBSTRATE WITHOUT USING A SOLDER MASK

Details for Australian Patent Application No. 2002234063 (hide)

Owner MOTOROLA, INC.

Inventors STONE, William, M.; UEHLING, Trent, S.; CLEGG, David, B.; CARPENTER, Burton, J.; VO, Nhat, D.; CLARK, Christopher, T.

Pub. Number AU-A-2002234063

PCT Pub. Number WO2003/071842

Filing date 26 December 2001

Wipo publication date 9 September 2003

International Classifications

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

9 October 2003 Application Open to Public Inspection

  Published as AU-A-2002234063

9 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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