METHOD OF MODULATING SURFACE MOUNT TECHNOLOGY SOLDER VOLUME TO OPTIMIZE RELIABILITY AND FINE PITCH YIELD

Details for Australian Patent Application No. 2002232841 (hide)

Owner ADVANCED MICRO DEVICES, INC.

Inventors BLISH, Richard, C., II; LIKINS, Robert, E.

Pub. Number AU-A-2002232841

PCT Pub. Number WO2002/080636

Priority 09/822,562 30.03.01 US

Filing date 19 December 2001

Wipo publication date 15 October 2002

International Classifications

H05K 003/12 Apparatus or processes for manufacturing printed circuits - using printing techniques to apply the conductive material

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

B41M 001/12 Inking and printing with a printer's forme - Stencil printing

Event Publications

3 April 2003 Application Open to Public Inspection

  Published as AU-A-2002232841

19 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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