HIGH POLYMER PLATE AND CONDUCTIVE PLATE CONNECTING BODY, AND PART USING THE CONNECTING PLATE

Details for Australian Patent Application No. 2002228434 (hide)

Owner TOYO KOHAN CO., LTD.

Inventors OHSAWA, Shinji; SAIJO, Kinji; YOSHIDA, Kazuo; OKAMOTO, Hiroaki

Pub. Number AU-A-2002228434

PCT Pub. Number WO2002/074531

Priority 2001-77143 16.03.01 JP

Filing date 5 February 2002

Wipo publication date 3 October 2002

International Classifications

B32B 015/08 Layered products essentially comprising metal - of synthetic resin

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

Event Publications

27 March 2003 Application Open to Public Inspection

  Published as AU-A-2002228434

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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