LEAD-FREE SOLDER STRUCTURE AND METHOD FOR HIGH FATIGUE LIFE

Details for Australian Patent Application No. 2002228187 (hide)

Owner INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventors RAY, Sudipta, Kumar; SARKHEL, Amit, Kumar

Pub. Number AU-A-2002228187

PCT Pub. Number WO2002/063674

Priority 09/779,812 08.02.01 US

Filing date 30 January 2002

Wipo publication date 19 August 2002

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

B23K 035/24 Rods, electrodes, materials, or media, for use in soldering, welding, or cutting - Selection of soldering or welding materials proper

H01L 023/488 Details of semiconductor or other solid state devices

Event Publications

13 February 2003 Application Open to Public Inspection

  Published as AU-A-2002228187

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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