HEAT TREATMENT APPARATUS AND WAFER SUPPORT RING

Details for Australian Patent Application No. 2002226760 (hide)

Owner TOKYO ELECTRON LIMITED

Inventors SHIGEOKA, Takashi; SHIMIZU, Masahiro; SAKUMA, Takeshi

Pub. Number AU-A-2002226760

PCT Pub. Number WO2002/061808

Priority 2001-022454 30.01.01 JP

Filing date 29 January 2002

Wipo publication date 12 August 2002

International Classifications

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

20 February 2003 Application Open to Public Inspection

  Published as AU-A-2002226760

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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