METHOD OF ELECTROLESS PLATING AND APPARATUS FOR ELECTROLESS PLATING

Details for Australian Patent Application No. 2002226750 (hide)

Owner TOKYO ELECTRON LIMITED

Inventors SATO, Hiroshi

Pub. Number AU-A-2002226750

PCT Pub. Number WO2002/063067

Priority 2001-30824 07.02.01 JP

Filing date 29 January 2002

Wipo publication date 19 August 2002

International Classifications

C23C 018/31 Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating - Coating with metals

H01L 021/768 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/288 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

13 February 2003 Application Open to Public Inspection

  Published as AU-A-2002226750

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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