METHODS FOR MAKING REINFORCED WAFER POLSHING PADS AND APPARATUSES IMPLEMENTING THE SAME

Details for Australian Patent Application No. 2002226020 (hide)

Owner LAM RESEARCH CORPORATION

Inventors XU, Cangshan; ZHAO, Eugene, Y.; DAI, Fen

Pub. Number AU-A-2002226020

PCT Pub. Number WO2002/051587

Priority 09/752,703 27.12.00 US; 09/752,509 27.12.00 US

Filing date 7 December 2001

Wipo publication date 8 July 2002

International Classifications

B24B 037/04 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped - designed for working plane surfaces

B24D 011/00 Constructional features of flexible abrasive materials

B24D 018/00 Manufacture of grinding tools, e.g. wheels, not otherwise provided for

Event Publications

23 January 2003 Application Open to Public Inspection

  Published as AU-A-2002226020

5 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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