THERMOSETTING RESIN COMPOSITION, AND PREPREG, LAMINATE FOR CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD EACH MADE THEREWITH

Details for Australian Patent Application No. 2002225388 (hide)

Owner HITACHI CHEMICAL CO., LTD.

Inventors TAKEDA, Yoshiyuki; HIRAI, Yasuyuki; KAMOSHIDA, Shinichi; KAKITANI, Minoru; ABE, Norihiro; NUMATA, Syunichi; AIZAWA, Teruki; NANAUMI, Ken; OOHORI, Kenichi; NAKAMURA, Yoshihiro; MURAI, Hikari

Pub. Number AU-A-2002225388

PCT Pub. Number WO2002/055603

Priority 2001-2763 10.01.01 JP

Filing date 10 January 2002

Wipo publication date 24 July 2002

International Classifications

C08L 061/34 Compositions of condensation polymers of aldehydes or ketones

C08J 005/24 Manufacture of articles or shaped materials containing macromolecular substances - Impregnating materials with prepolymers which can be polymerised , e.g. manufacture of prepregs

B32B 015/08 Layered products essentially comprising metal - of synthetic resin

H05K 001/03 Printed circuits - Use of materials for the substrate

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

Event Publications

6 February 2003 Application Open to Public Inspection

  Published as AU-A-2002225388

5 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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