HEAT DISSIPATION TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Details for Australian Patent Application No. 2002222735 (hide)

International Classifications

Event Publications

20 February 2003 Application Open to Public Inspection

Published as AU-A-2002222735

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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