METHOD FOR PRODUCING ELECTROCONDUCTIVE STRUCTURES

Details for Australian Patent Application No. 2002221425 (hide)

Owner ELMICRON AG

Inventors STEIERT, Philippe; WALZ, Silke

Pub. Number AU-A-2002221425

PCT Pub. Number WO2002/054840

Priority PCT/CH01/00004 04.01.01 CH; 1232/01 04.07.01 CH

Filing date 3 January 2002

Wipo publication date 16 July 2002

International Classifications

H05K 003/10 Apparatus or processes for manufacturing printed circuits - in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

C25D 003/38 Electroplating - of copper

Event Publications

23 January 2003 Application Open to Public Inspection

  Published as AU-A-2002221425

5 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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