PHOTOREACTIVE HOT-MELT ADHESIVE COMPOSITION

Details for Australian Patent Application No. 2002219613 (hide)

Owner SEKISUI CHEMICAL CO., LTD.

Inventors SHINJO, Takashi; MIYAKE, Takeshi; YAMAUCHI, Kenji

Pub. Number AU-A-2002219613

PCT Pub. Number WO2002/055625

Priority 2001-347707 13.11.01 JP; 2001-6563 15.01.01 JP; 2001-54576 28.02.01 JP; 2001-347706 13.11.01 JP

Filing date 15 January 2002

Wipo publication date 24 July 2002

International Classifications

C09J 163/00 Adhesives based on epoxy resins

C09J 163/02 Adhesives based on epoxy resins - Polyglycidyl ethers of bis-phenols

C09J 171/02 Adhesives based on polyethers obtained by reactions forming an ether link in the main chain

Event Publications

6 February 2003 Application Open to Public Inspection

  Published as AU-A-2002219613

5 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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