FORMING DEVICE FOR THERMOPLASTIC RESIN FORMED PART

Details for Australian Patent Application No. 2002219570 (hide)

Owner SEKISUI CHEMICAL CO., LTD.

Inventors SHIMURA, Satoshi; KAWAUCHI, Hitoshi; HIRANO, Hiroyuki

Pub. Number AU-A-2002219570

PCT Pub. Number WO2002/055282

Priority 2001-3780 11.01.01 JP

Filing date 9 January 2002

Wipo publication date 24 July 2002

International Classifications

B29C 045/18 Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould - Feeding the material into the injection moulding apparatus

B29C 045/60 Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould

Event Publications

6 February 2003 Application Open to Public Inspection

  Published as AU-A-2002219570

5 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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