ENHANCED DIE-UP BALL GRID ARRAY PACKAGES AND METHOD FOR MAKING THE SAME

Details for Australian Patent Application No. 2002217986 (hide)

Owner BROADCOM CORPORATION

Inventors ZHAO, Sam, Ziqun; KHAN, Reza-ur, Rahman; BACHER, Brent

Pub. Number AU-A-2002217986

PCT Pub. Number WO2002/052645

Priority 09/742,366 22.12.00 US; 09/984,259 29.10.01 US

Filing date 30 November 2001

Wipo publication date 8 July 2002

International Classifications

H01L 023/498 Details of semiconductor or other solid state devices

H01L 023/367 Details of semiconductor or other solid state devices

H01L 023/50 Details of semiconductor or other solid state devices

Event Publications

23 January 2003 Application Open to Public Inspection

  Published as AU-A-2002217986

5 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2002217987

2002217985