STRUCTURAL REINFORCEMENT OF HIGHLY POROUS LOW K DIELECTRIC FILMS BY ILD POSTS

Details for Australian Patent Application No. 2002217931 (hide)

Owner INTEL CORPORATION

Inventors WONG, Lawrence, D.

Pub. Number AU-A-2002217931

PCT Pub. Number WO2002/052630

Priority 09/745,705 21.12.00 US

Filing date 20 November 2001

Wipo publication date 8 July 2002

International Classifications

H01L 021/316 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

23 January 2003 Application Open to Public Inspection

  Published as AU-A-2002217931

5 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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