A METHOD FOR THE IMPLEMENTATION OF ELECTRONIC COMPONENTS IN VIA-HOLES OF A MULTILAYER MULTI-CHIP MODULE

Details for Australian Patent Application No. 2002212666 (hide)

Owner CEREL (CERAMICS TECHNOLOGIES) LTD.

Inventors SCHUSTER, Israel

Pub. Number AU-A-2002212666

PCT Pub. Number WO2002/060229

Priority 141118 25.01.01 IL

Filing date 25 October 2001

Wipo publication date 6 August 2002

International Classifications

H05K 001/16 Printed circuits - incorporating printed electric components, e.g. printed resistor, capacitor, inductor

H05K 003/40 Apparatus or processes for manufacturing printed circuits - Forming printed elements for providing electric connections to or between printed circuits

H01L 023/64 Details of semiconductor or other solid state devices

Event Publications

6 February 2003 Application Open to Public Inspection

  Published as AU-A-2002212666

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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