PHOTOSENSITIVE RESIN COMPOSITION AND PRINTED CIRCUIT BOARD

Details for Australian Patent Application No. 2001290318 (hide)

Owner TAIYO INK MFG. CO., LTD.

Inventors SUTO, Tetsuya; NISHIO, Kazunori

Pub. Number AU-A-2001290318

PCT Pub. Number WO2003/032089

Filing date 28 September 2001

Wipo publication date 22 April 2003

International Classifications

G03F 007/027 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

H05K 003/28 Apparatus or processes for manufacturing printed circuits - Applying non-metallic protective coatings

C08F 290/06 Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups

C08G 059/14 Polycondensates containing more than one epoxy group per molecule

Event Publications

3 July 2003 Application Open to Public Inspection

  Published as AU-A-2001290318

17 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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