METHOD FOR FORMING DEVICELANDING PAD OF MULTI-LAYERED PRINTED CIRCUIT BOARD

Details for Australian Patent Application No. 2001282660 (hide)

Owner DAP CORPORATION

Inventors LEE, Seong, Heon

Pub. Number AU-A-2001282660

PCT Pub. Number WO2003/013201

Priority 2001/46850 02.08.01 KR

Filing date 31 August 2001

Wipo publication date 17 February 2003

International Classifications

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

Event Publications

29 May 2003 Application Open to Public Inspection

  Published as AU-A-2001282660

6 May 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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