MICROELECTRONIC PACKAGES INCLUDING THIN FILM DECAL AND DIELECTRIC ADHESIVE LAYER HAVING CONDUCTIVE VIAS THEREIN, AND METHODS OF FABRICATING THE SAME

Details for Australian Patent Application No. 2001277644 (hide)

Owner VIRTUAL INTEGRATION, INC.

Inventors JACOBS, Scott

Pub. Number AU-A-2001277644

PCT Pub. Number WO2003/017367

Filing date 17 August 2001

Wipo publication date 3 March 2003

International Classifications

H01L 023/498 Details of semiconductor or other solid state devices

H01L 021/68 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

H05K 003/00 Apparatus or processes for manufacturing printed circuits

Event Publications

29 May 2003 Application Open to Public Inspection

  Published as AU-A-2001277644

6 May 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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