ABRASIVE ARTICLE SUITABLE FOR MODIFYING A SEMICONDUCTOR WAFER

Details for Australian Patent Application No. 2001269838 (hide)

Owner 3M INNOVATIVE PROPERTIES COMPANY

Inventors BRUXVOORT, Wesley, J.

Pub. Number AU-A-2001269838

PCT Pub. Number WO2002/062527

Priority 09/778,530 07.02.01 US

Filing date 14 June 2001

Wipo publication date 19 August 2002

International Classifications

B24B 037/04 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped - designed for working plane surfaces

B24D 013/12 Wheels having flexibly-acting working parts, e.g. buffing wheels

B24D 013/14 Wheels having flexibly-acting working parts, e.g. buffing wheels

Event Publications

13 February 2003 Application Open to Public Inspection

  Published as AU-A-2001269838

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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