A METHOD OF PACKAGING A SEMICONDUCTOR CHIP

Details for Australian Patent Application No. 2001260956 (hide)

Owner INFINEON TECHNOLOGIES AG

Inventors TAN, Loon, Lee

Pub. Number AU-A-2001260956

PCT Pub. Number WO2002/097877

Filing date 28 May 2001

Wipo publication date 9 December 2002

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/50 Details of semiconductor or other solid state devices

H01L 021/56 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

8 May 2003 Application Open to Public Inspection

  Published as AU-A-2001260956

17 July 2003 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  Application withdrawn under section 141(3)/See Reg. 8.3(2). Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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