POLYPROPYLENE RESIN COMPOSITION HAVING THERMAL RESISTANCE, HIGH RIGIDITY AND LOW WARPAGE PROPERTIES

Details for Australian Patent Application No. 2001225553 (hide)

Owner SAMSUNG GENERAL CHEMICALS CO., LTD.

Inventors HONG, Jong-Soo; LEE, Yoon-Hwan; HER, Man-Seang

Pub. Number AU-A-2001225553

PCT Pub. Number WO2002/051930

Filing date 22 December 2000

Wipo publication date 8 July 2002

International Classifications

C08L 023/12 Compositions of macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds

C08K 003/34 Use of inorganic ingredients

C08K 007/14 Use of ingredients characterised by shape

Event Publications

23 January 2003 Application Open to Public Inspection

  Published as AU-A-2001225553

5 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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